Method for preparing ultra hard cutting material e.g. monocrystalline diamond used for cutting tool, involves irradiating electron beam on ultra hard cutting material

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This patent describes a method for preparing ultra-hard cutting materials, such as monocrystalline diamond, by irradiating them with a combined, focused electron beam at a high power density. The process allows for precise control of the irradiation conditions, making it possible to enhance the properties of the cutting material.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of industrial cutting tools that require high hardness and durability
• Production of precision machining components where ultra-hard cutting materials are essential
• Enhancing performance of cutting tools used in mining, drilling, or metalworking industries
• Medical device manufacturing for cutting or drilling delicate materials
• Fabrication of semiconductor wafers and other electronics where precise material removal is needed

BenefitsContent extracted from patent full text and abstract with AI.

• Improved hardness and durability of cutting materials
• Ability to fine-tune material properties for specific applications
• Enhanced performance and lifespan of cutting tools
• Precise and consistent processing with high repeatability
• Potential reduction in manufacturing costs due to advanced processing techniques

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Patent Abstract

The method involves irradiating electron beam on ultra hard cutting material. The electron beams are combined by focusing device and the combined beams are provided to the ultra hard cutting material. The irradiation of the electron beams is performed at specific operating point. The power density of the electron beams is set to 108 W/cm 2>. An independent claim is included for ultra hard cutting material.