Device for capacitive humidity measurement of composite structure i.e. laminated wood composite structure, has sensor provided with two sensor elements, where one of sensor elements is provided in contact with hygroscopic adhesive layer

Publication: DE102008035658A1
Published: 2010-02-11
Family Size: 1
Granted: No

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to a device for capacitive humidity measurement within composite structures, such as laminated wood. The device incorporates a sensor that features two conductive elements, one of which directly contacts a moisture-absorbing adhesive layer within the structure. By measuring the dielectric properties between the sensor elements, the device can accurately gauge the humidity present inside the composite material.

Use CasesContent extracted from patent full text and abstract with AI.

  • Monitoring moisture content in wood-based building materials to prevent damage or degradation
  • Quality control during the production of laminated wood and composite products
  • Integrating into smart building systems for real-time environmental monitoring
  • Research applications related to moisture dynamics in multi-layered or hygroscopic materials
  • Preventing mold growth and structural weaknesses in construction by early humidity detection

BenefitsContent extracted from patent full text and abstract with AI.

  • Provides precise, in-situ humidity measurements within multi-layered composite materials
  • Enables early detection of moisture-related issues, reducing maintenance costs and structural risks
  • Supports quality assurance and consistency during composite manufacturing processes
  • Can be embedded directly into products for continuous long-term monitoring
  • Improves safety and longevity of wood-based constructions by avoiding excessive humidity build-up

Technical Classifications (CPCs)

Main Classifications

Physics & Measurement

Sub Classifications

Measuring & Testing

CPC Codes

G01N27/223G01N33/46

Inventors & Applicants

Applicants

Kompetenzzentrum Strukturleich

Univ Chemnitz Tech

Patent Abstract

The device has a sensor (20) provided with two sensor elements (22, 24), where one of the sensor elements is provided in contact with a hygroscopic adhesive layer. The sensor elements are embedded in the adhesive layer next to each other. The sensor elements are formed in a form of parallel running electrical conductors, which are interconnected at an end. The sensor elements are covered with a layer of a precious metal at an outer circumference. A measuring device is arranged at ports (22a, 24a) for measurement of dielectric constant of the adhesive layer and/or a hygroscopic material. Independent claims are also included for the following: (1) a method for capacitive humidity measurement of a composite structure that consists of several layers of a hygroscopic material (2) a method for production of a composite structure.

Key Information

Publication No.

DE102008035658A1

Family ID

41501074

Publication Date

2010-02-11

Application No.

DE102008035658A

Application Date

2008-07-31

Priority Date

2008-07-31

Granted

No

Possible Cooperation

For further information please contact the transfer office.