High frequency antenna structure for use in radio frequency identification marker, has conductive layer arranged on dielectric layer and separated from another conductive layer, where former conductive layer is formed as aligning element

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a high frequency antenna structure designed for use in radio frequency identification (RFID) markers. The design features multiple layers, including dielectric and conductive elements, where a specific arrangement allows one conductive layer to serve as an aligning element. The layers are stacked perpendicularly, enhancing the performance and manufacturability of high frequency antennas.

Use CasesContent extracted from patent full text and abstract with AI.

• Improving the accuracy and reliability of RFID systems in logistics and inventory tracking
• Enabling high-frequency RFID tags for use in retail and supply chain management
• Facilitating secure item identification and authentication in access control systems
• Supporting robust, miniature antennas for smart cards and electronic labeling
• Integrating advanced RFID antennas into industrial automation and asset tracking solutions

BenefitsContent extracted from patent full text and abstract with AI.

• Enhanced antenna performance at high frequencies due to multi-layer structure
• Improved alignment during manufacturing, leading to higher production yields and consistency
• Potential for smaller, more reliable RFID tags as a result of the precise layer arrangement
• Increased durability and robustness of the antenna structure in challenging environments
• Greater flexibility for integration into a variety of RFID-enabled products

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Inventors & Applicants

Patent Abstract

The structure (200) has a dielectric layer (202) arranged on a metallic upper surface (210). A conductive layer (204) is arranged on the dielectric layer and includes antenna connections. Another dielectric layer (206) is arranged over the former dielectric layer, and another conductive layer (208) is arranged on the latter dielectric layer and separated from the former conductive layer, where the latter conductive layer is formed as an aligning element. The conductive layers are arranged in a direction perpendicular to an upper surface of the dielectric layers. An independent claim is also included for a method for manufacturing a high frequency antenna structure.