Connecting Element with a Pin Structure

Publication: DE102019133829A1
Published: 2021-06-10
Family Size: 2
Granted: Yes (1/2)

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to a connecting element featuring a series of pins, where each pin is positioned within a through-hole in a single-shell main body. Each pin can move within its respective hole along the longitudinal axis toward a component, allowing for adjustable or dynamic connections.

Use CasesContent extracted from patent full text and abstract with AI.

  • Electrical connectors for circuit boards or electronic devices
  • Mechanical fasteners for modular assembly systems
  • Pin-based locking or securing mechanisms for machinery
  • Connection interfaces in automotive or aerospace components

BenefitsContent extracted from patent full text and abstract with AI.

  • Provides adjustable and secure connections
  • Enables easier assembly and disassembly of components
  • The single-shell body simplifies manufacturing and enhances durability
  • Allows for precise alignment of connected components

Technical Classifications (CPCs)

Main Classifications

Mechanical Eng. & Systems

Sub Classifications

Engineering Elements & Units

CPC Codes

F16B7/042F16B15/0053

Inventors & Applicants

Applicants

Univ Chemnitz Tech

Patent Abstract

Die Erfindung betrifft ein Verbindungselement mit einer Pinstruktur, aufweisend einen Grundkörper mit darin zumindest bereichsweise angeordneten Durchgangslöchern, wobei der Grundkörper einschalig ausgebildet ist und in den Durchgangslöchern eine Pinstruktur mit je einem Pin pro Durchgangsloch entlang der Längsachse des Durchgangsloches angeordnet ist und dass der Pin in Richtung eines Bauteils innerhalb des Durchgangslochs bewegbar ist.

Key Information

Publication No.

DE102019133829A1

Family ID

75962440

Publication Date

2021-06-10

Application No.

DE102019133829A

Application Date

2019-12-10

Priority Date

2019-12-10

Granted

Yes (1/2)

Possible Cooperation

For further information please contact the transfer office.