Printed Circuit Board, Millimeter Wave System, and Method for Operating a Millimeter Wave System

Publication: DE102014115313B4
Published: 2024-02-08
Family Size: 8
Granted: Yes (4/8)

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a special type of circuit board (PCB) designed for millimeter-wave systems. The PCB includes a signal line that passes over a cavity within the board, surrounded by multiple conductive vias (vertical electrical connections), including blind vias near the cavity. This structure helps manage signal transmission and isolation in high-frequency applications like millimeter-wave technology.

Use CasesContent extracted from patent full text and abstract with AI.

  • High-speed wireless communication systems (such as 5G or future 6G base stations)
  • Radar systems for automotive safety and object detection
  • Advanced sensing equipment (like airport security scanners or medical imaging devices)
  • Satellite communications equipment
  • Testing and measurement devices for high-frequency electronics

BenefitsContent extracted from patent full text and abstract with AI.

  • Enhances signal integrity for millimeter-wave frequencies, reducing signal loss and interference
  • Improves miniaturization and integration of high-frequency circuits on a single board
  • Supports complex and compact electronic designs for next-generation wireless technologies
  • Provides stronger electromagnetic shielding and isolation between components, improving device reliability
  • Facilitates advanced applications that require robust and high-performance PCB layouts for millimeter-wave operations

Technical Classifications (CPCs)

Main Classifications

Electrical & Electronic Tech

Sub Classifications

Electric Communication Technique

Electric Elements

Electric Techniques (Other)

CPC Codes

H01L23/13H01P3/12H01P5/107H04B10/2575H04B10/572H05K1/0206H05K1/024H05K1/0242H05K1/0251H05K1/116H05K1/181H05K3/4697

Inventors & Applicants

Applicants

Friedrich Alexander Universtitaet Erlangen Nuernberg

Infineon Technologies Ag

Patent Abstract

According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.

Key Information

Publication No.

DE102014115313B4

Family ID

52811874

Publication Date

2024-02-08

Application No.

DE102014115313A

Application Date

2014-10-21

Priority Date

2013-10-30

Granted

Yes (4/8)

Possible Cooperation

For further information please contact the transfer office.