Printed Circuit Board, Millimeter Wave System, and Method for Operating a Millimeter Wave System
Simple SummaryContent extracted from patent full text and abstract with AI.
This patent describes a special type of circuit board (PCB) designed for millimeter-wave systems. The PCB includes a signal line that passes over a cavity within the board, surrounded by multiple conductive vias (vertical electrical connections), including blind vias near the cavity. This structure helps manage signal transmission and isolation in high-frequency applications like millimeter-wave technology.
Use CasesContent extracted from patent full text and abstract with AI.
- High-speed wireless communication systems (such as 5G or future 6G base stations)
- Radar systems for automotive safety and object detection
- Advanced sensing equipment (like airport security scanners or medical imaging devices)
- Satellite communications equipment
- Testing and measurement devices for high-frequency electronics
BenefitsContent extracted from patent full text and abstract with AI.
- Enhances signal integrity for millimeter-wave frequencies, reducing signal loss and interference
- Improves miniaturization and integration of high-frequency circuits on a single board
- Supports complex and compact electronic designs for next-generation wireless technologies
- Provides stronger electromagnetic shielding and isolation between components, improving device reliability
- Facilitates advanced applications that require robust and high-performance PCB layouts for millimeter-wave operations
Technical Classifications (CPCs)
Main Classifications
Electrical & Electronic Tech
Sub Classifications
Electric Communication Technique
Electric Elements
Electric Techniques (Other)
CPC Codes
Inventors & Applicants
Applicants
Friedrich Alexander Universtitaet Erlangen Nuernberg
Infineon Technologies Ag
Patent Abstract
According to an embodiment, a circuit board includes a signal line including at least portion of a first conductive layer that has a first portion extending over a cavity in the circuit board from a first side of the cavity. The circuit board also includes a first plurality of conductive vias surrounding the cavity and the first plurality of vias include at least one blind via disposed adjacent to the first side of the cavity.
Key Information
Publication No.
DE102014115313B4
Family ID
52811874
Publication Date
2024-02-08
Application No.
DE102014115313A
Application Date
2014-10-21
Priority Date
2013-10-30
Granted
Yes (4/8)
Possible Cooperation
For further information please contact the transfer office.