Method for Applying at Least One Electrical or Electronic Component to the Surface of an Object

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This patent discloses a method for transferring and adhering at least one electrical or electronic component, such as a conductive track, semiconductor device, or RFID transponder, onto the surface of a 3D object. The process uses a water-transfer printing technique: the components are arranged on a water-soluble carrier film, which is placed on the surface of a liquid (usually water). The object is dipped through the liquid, causing the component to transfer and adhere to the object's surface via liquid pressure. This process enables uniform application of components to complex or irregular shapes without the need for high temperatures or soldering.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of 3D circuit carriers (Molded Interconnect Devices - MID) for electronic devices.
• Adding conductive tracks, sensors, or LED elements to curved plastic parts, e.g., automotive components, wearable devices, or household appliances.
• Applying RFID transponders or electronic labels to products or even living beings (humans, animals) for identification or tracking.
• Embedding electronic or conductive elements onto medical sensors with complex geometries.
• Integrating decorative and functional electronic elements (e.g., light-up logos) onto consumer product surfaces in a single step.

BenefitsContent extracted from patent full text and abstract with AI.

• Allows application of electronic elements to complex 3D surfaces easily and uniformly.
• Eliminates the need for soldering and high temperatures, enabling use with heat-sensitive materials.
• Reduces production steps, material usage, and assembly complexity, leading to lower costs.
• Enables simultaneous application of decorative and functional elements.
• Supports greener manufacturing by reducing the number of materials and simplifying recycling.
• Facilitates the production of customized or small-batch electronic assemblies without the need for expensive tool changes.

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Inventors & Applicants

Patent Abstract

A method for applying at least one electrical or electronic component (1) to the surface of an object (7) is mentioned, wherein the at least one electrical or electronic component (1) is applied to a liquid-soluble carrier substrate (6), wherein the carrier substrate (6) is arranged on the surface (10) of a liquid, wherein the object (7) dips through the surface (10) of the liquid on which the carrier substrate (6) is arranged, wherein the electrical or electronic component (1) is pressed onto the surface of the object (7) by the pressure of the liquid and is thereby applied with adhesion, and wherein the object (7) with the at least one electrical or electronic component (1) applied is removed from the liquid. Furthermore, an assembly (20) comprising a main body (8) and comprising at least one electrical or electronic component (1) is mentioned, wherein the electrical or electronic component (1) is applied to the surface of the main body (8) by such a method.