Substrate with RF-Compatible Conductor

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a multi-layer electronic substrate with a high-frequency (HF) suitable signal line. The signal line is positioned between two ground planes, where at least one ground plane has a slit that follows the path of the signal line. This design reduces the capacitive load on the line, allowing the impedance to be increased, which is especially valuable when physical constraints on layer thickness or conductor width limit traditional impedance tuning methods.

Use CasesContent extracted from patent full text and abstract with AI.

• RF circuits in communication devices (such as mobile phones, wireless modules)
• Substrates for mounting high-frequency components like SAW or BAW filters, duplexers, and resonators
• RF front-end modules for mobile and wireless communication devices
• Miniaturized electronic modules requiring precise HF signal transmission
• Advanced multi-layer PCB and LTCC substrates for microwave or millimeter wave circuits

BenefitsContent extracted from patent full text and abstract with AI.

• Enables achieving high, controlled line impedance (e.g., standard 50 Ohm) even in miniaturized, multi-layer substrates
• Simple adjustment of impedance through slit width without compromising insulation quality
• Offers better insulation than traditional microstrip lines and higher impedance than conventional triplate striplines
• Supports miniaturization by allowing high-frequency performance in thin or tightly packed substrates
• Compatible with LTCC and other low-permittivity materials, further improving high-frequency signal integrity
• Flexible for complex and dense circuit layouts including multiple signal lines and ground segmentation
• Can improve performance and reduce parasitic capacitance in high-density HF modules

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a substrate comprising an HF-compatible line having a similar design to that of a triplate stripline. At least one of the ground planes has a slit which follows the course of the signal line arranged between two ground planes. Said slit can be used to reduce the capacitive layer of the line and thereby increase the impedence of the line.