Atomic Layer Process Printer

Simple SummaryContent extracted from patent full text and abstract with AI.

The invention is an atomic layer process printer designed for highly precise material deposition, etching, and cleaning at the atomic or nanometer scale, with selective area control. Unlike conventional Atomic Layer Deposition (ALD) systems, this printer allows direct digital patterning of materials, including metals, oxides, nitrides, and more, with resolutions down to 20 nanometers and the ability to create complex 3D structures. The device uses a moveable substrate plate and a specialized printer head with micron- or sub-micron sized nozzles, enabling advanced material processing under a variety of pressures and temperatures, and with high efficiency in handling different precursor fluids.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacturing of advanced semiconductor devices and integrated circuits with nanoscale features.
• Fabrication of high-resolution, multi-material 3D nanostructures for microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS).
• Production of advanced sensors and biosensors requiring precise patterning of functional materials.
• Development of flexible, high-performance electronic, photonic, and optoelectronic devices.
• Deposition of complex, multi-layered coatings with atomic precision for research and industrial purposes.
• Selective etching and cleaning of surfaces during device fabrication.
• Rapid prototyping of nanodevices and material studies in research laboratories.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables atomic-scale resolution and nanometer-precision in both 2D and 3D patterning, exceeding current ALD and additive manufacturing capabilities.
• Supports the direct creation of complex, three-dimensional nanostructures, not just flat films.
• High material and process versatility—can handle a wide range of precursors including metals, oxides, nitrides, and mixed compounds.
• Reduces material waste and improves efficiency compared to traditional chamber-based deposition techniques.
• Capable of additive (deposition), subtractive (etching), and cleaning processes in the same device.
• Adaptable to various substrate types, including both organic and inorganic materials with plain or corrugated surfaces.
• Operable under atmospheric, vacuum, or controlled ambients, and across a wide temperature range (room temp to >400°C).
• Minimizes cross-contamination between precursors for multi-material or heterostructure fabrication.
• Enables faster processing and higher throughput via spatial ALD principles and direct patterning.
• Provides better control over 3D geometry due to multi-axis movement (in X, Y, Z plus rotation and tilt) of substrate and printer head.

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Inventors & Applicants

Patent Abstract

The invention relates to an atomic layer process printer for material deposition, etching and/or cleaning on an atomic scale in a selective area. The invention further relates to a method for material deposition, etching and/or cleaning on an atomic scale in a selective area using the atomic layer process printer.