Method for Manufacturing an Electronic or Electrical System, and System Which Is Manufactured in Accordance with the Method

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This invention describes a method for manufacturing electronic or electrical systems using a layer-free, three-dimensional additive process rather than traditional planar, layer-by-layer techniques. The process enables the direct, spatial creation of structures—such as signal conductors, waveguides, and passive components—that guide electromagnetic waves, by simultaneously or sequentially adding or removing materials. As a result, electronic systems can be fabricated with complex geometries, optimized for high-frequency applications, with improved integration and fewer signal-disturbing interconnections or vias.

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• Manufacturing high-frequency interposer boards with minimal signal distortion for connecting integrated circuits (ICs) in advanced electronics.
• Producing test adapters (device interfaces) for high-speed IC testing, providing precise, low-crosstalk signal paths.
• Integration of multiple ICs and passive components in highly compact, multi-functional electronic packages.
• Making automotive radar frontends, including built-in antennas and signal paths, directly on substrates shaped as car parts like bumpers.
• On-demand fabrication of spare electronic modules for long-life or obsolete equipment (e.g., in automotive or aviation industries), reducing spare-part storage needs.
• Replacing conventional multi-layer circuit boards in RF applications to allow for higher data rates and signal integrity.
• Producing highly integrated radio modules with directly connected transceivers and antennas for wireless devices.
• Creating optical waveguides for interconnecting optoelectronic modules with minimal crosstalk.

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces the number of signal-disrupting interconnections (vias, solder joints, bond wires), improving signal integrity, especially for high-frequency and high-data-rate applications.
• Enables three-dimensional design freedom, allowing for compact, highly integrated electronic layouts that are mechanically, thermally, and electrically optimized.
• Simplifies the manufacturing process by reducing the number of steps and the necessity for multiple machines, lowering costs and production errors.
• Allows in-process functional testing and correction during manufacturing, enabling higher quality and reduced waste (faulty parts can be reworked instead of scrapped).
• Material-efficient and environmentally friendly, as material is only deposited where needed and waste is minimized.
• Enables rapid prototyping and flexible production scaling, reducing product introduction time and economic risk.
• Minimizes crosstalk and signal reflections, as conductors can be individually shielded and precisely routed, even when crossing each other in three dimensions.
• Facilitates easier, more flexible adaptation or repair, and supports obsolescence management by enabling on-demand low-volume manufacturing of replacement parts.

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Patent Abstract

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.