Electrical Component with an Electrical Connection Arrangement and Method for its Manufacture

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes an improved structure and manufacturing method for electrical components, such as flip-chip modules, where specialized small spacer elements are positioned at the edge of the connection zone between an electronic component and its carrier. These spacers are lower in height than standard solder bumps and have a higher melting point, thus providing a controlled gap during soldering and preventing the component from floating on underfill material. This leads to more reliable and robust electrical connections, especially with very small solder bumps.

Use CasesContent extracted from patent full text and abstract with AI.

• Assembly of high-density flip-chip modules in microelectronics and semiconductor packaging
• Production of surface-mount devices (SMDs) with tiny solder bumps such as in advanced integrated circuits
• Manufacture of multi-chip modules (MCMs) and chip-scale packages
• Electrical assemblies that require highly reliable connections in compact form factors
• Electronic components intended for harsh or variable environments, including implants for medical devices

BenefitsContent extracted from patent full text and abstract with AI.

• Prevents floating of chips on underfill material during soldering, leading to improved assembly accuracy
• Ensures more reliable and repeatable minimum gap between the component and carrier, improving electrical and mechanical integrity
• Reduces risk of short circuits and failures due to solder bump collapse or shifting during the manufacturing process
• Compatible with very small solder bumps and high interconnect densities, enabling further electronic miniaturization
• Allows for better protection of the electrical assembly against environmental factors, such as humidity or temperature changes, via hermetic sealing

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The component e.g. flip chip, has an active surface and/or a carrier (102) comprising electrical connecting elements in a connection zone (112). A spacer element is provided on the active surface and/or the carrier. The spacer element has a small height for fusing of the connecting elements for producing an electrically conductive connection, where the spacer element is arranged in an edge region of the connection zone. An independent claim is also included for a method for manufacturing an electrical component or module.