Semiconductor Package with Integrated Microwave Component

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a semiconductor device package that integrates a microwave component with at least one electrically conducting wall structure directly into the encapsulant, along with a semiconductor chip. An electrical interconnect connects the microwave component to the chip, allowing for efficient integration of microwave functionality within the semiconductor package.

Use CasesContent extracted from patent full text and abstract with AI.

• Wireless communication modules needing high-frequency microwave components
• Radar and automotive sensor devices for advanced driver-assistance systems (ADAS)
• 5G and satellite communication hardware
• Miniaturized RF and microwave circuits for IoT or mobile devices
• Medical imaging and diagnostic equipment using microwave technology

BenefitsContent extracted from patent full text and abstract with AI.

• Reduces overall size and complexity of microwave-enabled semiconductor devices
• Improves electrical performance by minimizing signal loss and interference
• Enables more compact and integrated device designs for next-generation electronics
• Simplifies manufacturing by combining microwave and semiconductor functionalities into one package
• Supports higher-frequency applications necessary for modern communication and sensing technologies

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Inventors & Applicants

Patent Abstract

A semiconductor device package includes an encapsulant and a semiconductor chip. The semiconductor chip is at least partly embedded in the encapsulant. A microwave component including at least one electrically conducting wall structure is integrated in the encapsulant. Further, the semiconductor device package includes an electrical interconnect configured to electrically couple the microwave component to the semiconductor chip.