High-Frequency Technical System

Publication: DE102023106345A1
Published: 2024-09-19
Family Size: 2
Granted: No

Simple SummaryContent extracted from patent full text and abstract with AI.

The invention concerns an advanced radio-frequency (RF) system that utilizes a specially designed connector (termed 'Verbinder') to join a waveguide with another electronic or RF component, such as a circuit board. Unlike typical mechanical connections (screwing, soldering, gluing), this connector is precisely engineered to provide both a reliable mechanical joint and an optimal radio-frequency (electrical) connection for the efficient transmission of high-frequency electromagnetic waves. Its robust design accommodates mass production by reducing sensitivity to alignment and mechanical tolerances, thus improving both manufacturability and RF performance.

Use CasesContent extracted from patent full text and abstract with AI.

  • Connecting waveguides to printed circuit boards in high-frequency communication devices (e.g., radar, 5G, satellite communication)
  • Integrating antennas or antenna arrays with other RF modules or electronics in wireless systems
  • Reliable assembly solutions for automotive radar sensors operating in the mmWave band
  • Industrial automation equipment requiring high-frequency signal transmission with robust connections
  • Consumer electronics (e.g., Wi-Fi routers, smart home devices) requiring high-frequency interconnects
  • Medical imaging devices or scientific instruments operating at high RF/microwave frequencies

BenefitsContent extracted from patent full text and abstract with AI.

  • Enables both mechanical and RF-suitable connections in a single, simplified assembly
  • Improves production yield and reliability in mass-manufactured high-frequency devices
  • Reduces the risk of misalignment, signal loss, and mismatch at the connection point, even under slight mechanical deviations
  • Streamlines manufacturing process by enabling automation and compatibility with standard assembly tools
  • Supports a wide range of materials (stamped metal, dielectrics, plastics) and fabrication methods (injection molding, additive manufacturing)
  • Allows for miniaturization and high-frequency operation (e.g., above 3 MHz to mmWave) with robust, reproducible performance

Technical Classifications (CPCs)

Main Classifications

Electrical & Electronic Tech

Sub Classifications

Electric Elements

CPC Codes

H01P5/107

Inventors & Applicants

Applicants

Friedrich Alexander Univ Erlangen Nuernberg Koerperschaft des Oeffentlichen Rechts

Iwis Smart Connect Gmbh

Patent Abstract

The present invention relates to a system of radio-frequency technology comprising a waveguide, a component and a connector that is formed and arranged such that it connects the waveguide to the component, the connection comprising a mechanical connection, and the connection produced by the connector being a connection suitable for radio-frequency.

Key Information

Publication No.

DE102023106345A1

Family ID

90365396

Publication Date

2024-09-19

Application No.

DE102023106345A

Application Date

2023-03-14

Priority Date

2023-03-14

Granted

No

Possible Cooperation

For further information please contact the transfer office.