High-Frequency Technical System
Simple SummaryContent extracted from patent full text and abstract with AI.
The invention concerns an advanced radio-frequency (RF) system that utilizes a specially designed connector (termed 'Verbinder') to join a waveguide with another electronic or RF component, such as a circuit board. Unlike typical mechanical connections (screwing, soldering, gluing), this connector is precisely engineered to provide both a reliable mechanical joint and an optimal radio-frequency (electrical) connection for the efficient transmission of high-frequency electromagnetic waves. Its robust design accommodates mass production by reducing sensitivity to alignment and mechanical tolerances, thus improving both manufacturability and RF performance.
Use CasesContent extracted from patent full text and abstract with AI.
- Connecting waveguides to printed circuit boards in high-frequency communication devices (e.g., radar, 5G, satellite communication)
- Integrating antennas or antenna arrays with other RF modules or electronics in wireless systems
- Reliable assembly solutions for automotive radar sensors operating in the mmWave band
- Industrial automation equipment requiring high-frequency signal transmission with robust connections
- Consumer electronics (e.g., Wi-Fi routers, smart home devices) requiring high-frequency interconnects
- Medical imaging devices or scientific instruments operating at high RF/microwave frequencies
BenefitsContent extracted from patent full text and abstract with AI.
- Enables both mechanical and RF-suitable connections in a single, simplified assembly
- Improves production yield and reliability in mass-manufactured high-frequency devices
- Reduces the risk of misalignment, signal loss, and mismatch at the connection point, even under slight mechanical deviations
- Streamlines manufacturing process by enabling automation and compatibility with standard assembly tools
- Supports a wide range of materials (stamped metal, dielectrics, plastics) and fabrication methods (injection molding, additive manufacturing)
- Allows for miniaturization and high-frequency operation (e.g., above 3 MHz to mmWave) with robust, reproducible performance
Technical Classifications (CPCs)
Main Classifications
Electrical & Electronic Tech
Sub Classifications
Electric Elements
CPC Codes
Inventors & Applicants
Applicants
Friedrich Alexander Univ Erlangen Nuernberg Koerperschaft des Oeffentlichen Rechts
Iwis Smart Connect Gmbh
Patent Abstract
The present invention relates to a system of radio-frequency technology comprising a waveguide, a component and a connector that is formed and arranged such that it connects the waveguide to the component, the connection comprising a mechanical connection, and the connection produced by the connector being a connection suitable for radio-frequency.
Key Information
Publication No.
DE102023106345A1
Family ID
90365396
Publication Date
2024-09-19
Application No.
DE102023106345A
Application Date
2023-03-14
Priority Date
2023-03-14
Granted
No
Possible Cooperation
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