Method for Manufacturing a Circuit Carrier

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This invention describes a method for manufacturing circuit carriers (substrates for electronic circuits) using a novel ceramic material primarily made of aluminum oxide (Al₂O₃) and copper oxide (Cu₂O). The method involves creating fine structures on the ceramic surface using a laser, followed by the application of a metallic coating to form conductive traces. The process leverages the special composition of the ceramic to enable reliable and efficient laser structuring and subsequent metallization, resulting in highly stable, durable, and precisely structured circuit carriers.

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• High-reliability circuit boards and components for the automotive industry, especially for high-temperature or harsh conditions.
• Medical device electronics, where chemical, thermal, and mechanical stability are critical.
• Aerospace and avionics applications demanding resilient electronics substrates.
• Manufacturing of advanced LED lighting circuits that require excellent heat dissipation and long lifespan.
• Power electronics, such as substrates for high-power modules, where ceramic thermal management is beneficial.
• Microelectronic or sensor products for industrial or consumer IoT operating in challenging environments.

BenefitsContent extracted from patent full text and abstract with AI.

• Enables the use of robust ceramic substrates with high thermal, chemical, and mechanical stability for electronic circuits.
• Provides improved accuracy and reliability in laser structuring compared to traditional polymer-based substrates.
• Allows for three-dimensional and more complex circuit designs using generative (additive) processes.
• Results in higher quality and more durable metallic traces with increased thickness and adhesion.
• Significantly improves the thermal management and reduces thermal expansion mismatches in electronic assemblies, enhancing reliability.
• Avoids the use of environmentally harmful materials like chromium and overcomes limitations of previous ceramic structuring methods.
• Supports miniaturization and the creation of fine-pitched circuits with improved process control.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a method for producing a circuit carrier (43, 5) in which a carrier substrate (33, 35, 45) is provided, a structure (37, 47) for a conductor (40, 52) to be applied is introduced into the surface (31, 39, 39) of the carrier substrate (33, 35, 45) by means of a laser, wherein the structure (37, 47), while forming the circuit carrier (43, 54), is provided with a metal coating (41, 53) forming the conductor (40, 52). A ceramic material (12, 16) is used as the carrier substrate (33, 35, 45). The invention further relates to a carrier substrate (33, 35, 45) for a ceramic material (12, 16), to a use of a ceramic material (12, 16) as the carrier substrate (33, 35, 45), and to the ceramic material (12, 16) per se.