Method for Producing an Assembly of at Least One Supply Conductor Wrapped with a Wrapping Material

Publication: EP4542585A1
Published: 2025-04-23
Family Size: 2
Granted: No

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a method and apparatus for producing arrangements of one or more supply conductors (such as electrical cables, pipes, or data lines) that are wrapped with a protective covering material. The key innovation is applying a viscous or highly viscous wrapping material (for instance, a plastic or adhesive) in a fluid state onto the conductors via at least one nozzle, allowing for flexible, automated, and efficient encapsulation without the need for manual positioning or mold-based methods. The process can adjust to different conductor arrangements and allows for partial or full coverage as needed, supporting various geometries and connection types.

Use CasesContent extracted from patent full text and abstract with AI.

  • Automated manufacturing of vehicle wiring harnesses for automotive production.
  • Encapsulation of electrical or data cables in industrial machinery.
  • Protecting pipes or hoses in HVAC, plumbing, or fluid systems.
  • Production of bundled fiber optic cables with custom protection.
  • Creating cable assemblies for aerospace or railway applications where robust and adaptable insulation is required.

BenefitsContent extracted from patent full text and abstract with AI.

  • Highly automatable process, reducing the need for manual labor and improving production efficiency.
  • Lower material consumption compared to traditional mold-based or tape wrapping methods, as only required areas are covered and application is more precise.
  • Flexible adaptation to different cable or conductor arrangements (single, multiple, bundles) and cross-sectional geometries.
  • Improved protection of conductors against mechanical, thermal, or environmental influences.
  • Allows for selective coverage, leaving connection points or connectors exposed as needed.
  • Minimizes equipment footprint and complexity compared to conventional molding systems.
  • Process supports the use of various materials (thermoplastics, duroplastics, adhesives) and the integration of reinforcement fibers for customized properties.

Technical Classifications (CPCs)

Main Classifications

Electrical & Electronic Tech

Sub Classifications

Electric Elements

CPC Codes

H01B13/01281

Inventors & Applicants

Applicants

Friedrich Alexander Univ Erlangen Nuernberg in Vertretung des Freistaates Bayern

Patent Abstract

Verfahren und Vorrichtung (10) zur Herstellung einer mit einem Umhüllungsmaterial (20) umhüllten Anordnung (30) aus wenigstens einem Versorgungsleiter (31).

Key Information

Publication No.

EP4542585A1

Family ID

93119690

Publication Date

2025-04-23

Application No.

EP24206590A

Application Date

2024-10-15

Priority Date

2023-10-20

Granted

No

Possible Cooperation

For further information please contact the transfer office.