Layer producing method for application on e.g. polyimide foil, involves coating substrate with metallic reactant and introducing substrate into bath of non-metallic reactant, where bath is heated to temperature above limit temperature
Simple SummaryContent extracted from patent full text and abstract with AI.
This patent describes a method for forming a layer on a substrate, such as polyimide foil, by first coating it with a metal and then exposing it to a heated bath containing a non-metallic reactant and doping material. The process operates above a certain temperature threshold and enables the formation of new material layers, such as those useful in electronics.
Use CasesContent extracted from patent full text and abstract with AI.
- Fabrication of thin film solar cells
- Manufacture of flexible electronics and displays
- Creation of advanced semiconductor devices
- Production of sensors on flexible substrates
- Development of lightweight, flexible circuit boards
BenefitsContent extracted from patent full text and abstract with AI.
- Allows formation of high-quality layers on flexible substrates
- Enables use of multiple metals for tailored material properties
- Operates at temperatures suitable for temperature-sensitive materials like polyimide
- Supports doping during fabrication, enabling enhanced electrical properties
- Suitable for scalable and cost-effective mass production
Technical Classifications (CPCs)
Main Classifications
Electrical & Electronic Tech
Sub Classifications
Electric Elements
Semiconductor & Solid-State Devices
CPC Codes
Inventors & Applicants
Applicants
Univ Friedrich Alexander Er
Patent Abstract
The method involves manufacturing a layer consisting of a product by using metallic and non-metallic reactants by a process accomplished above a limit temperature. A substrate e.g. polyimide foil (1), is coated with the metallic reactant and is introduced into a bath (6) of the non-metallic reactant, where the bath is heated to a temperature above the limit temperature. A doping material i.e. sodium, is added to the bath, where the metallic reactant is selected from copper, indium, tin, zinc and gallium. An element such as selenium, is provided in the bath.
Key Information
Publication No.
DE102007062195A1
Family ID
39466002
Publication Date
2008-07-03
Application No.
DE102007062195A
Application Date
2007-12-21
Priority Date
2007-01-02
Granted
No
Possible Cooperation
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