Planar Heat Transfer Device and Method for Its Manufacture

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This invention describes a planar heat transfer device, designed primarily for efficient spread and removal of heat from flat sources such as electronic components or surfaces. The device consists of a cavity sandwiched between two walls (with at least one wall attached to the heat source), containing a working fluid and a specially formed capillary support structure. This structure, usually made from a folded wire mesh, simultaneously provides both mechanical support and capillary action. This ensures effective circulation of the condensed fluid back to the evaporation (hot) zone, allowing for consistent, uniform heat transfer across large, flat areas.

Use CasesContent extracted from patent full text and abstract with AI.

• Cooling and temperature management for photovoltaic (solar panel) arrays to increase efficiency.
• Thermal management for building walls (e.g., smart façades) to improve energy efficiency and comfort.
• Removal of heat from building interiors in air conditioning or climate control systems.
• Efficient cooling of large electronic devices or assemblies, such as server racks, battery packs, or industrial electronics.
• Temperature equalization in manufacturing processes requiring uniform surface temperatures.
• Thermal regulation in advanced display panels or LED arrays.

BenefitsContent extracted from patent full text and abstract with AI.

• Allows heat to be transferred efficiently and evenly over large, flat areas, overcoming size limitations of traditional heat pipes.
• The combined capillary and support structure increases mechanical stability, preventing structural collapse even under vacuum or thermal stresses.
• Reduces risk of local overheating by ensuring consistent fluid return to the hot regions.
• Can be manufactured with fewer parts—no need for separate supporting spacers or complex multi-layer sintering processes.
• Adaptable to different sizes and operating orientations, making it suitable for a wide range of industrial, electronics, and building applications.
• Capable of operating efficiently even when installed horizontally or at various inclinations, unlike some traditional solutions.

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Patent Abstract

The invention relates to a planar heat transfer apparatus for heat distribution and for removal of heat from a planar heat source (50). The apparatus comprises: a cavity (100), which is delimited by a first wall (110) for coupling to the planar heat source (50) and an opposite second wall (120) and which has a working fluid (150); and a capillary support structure (200) which extends folded in at least one direction (R) between the first wall (110) and the second wall (120) in order to provide a supporting effect and a capillary effect for condensed working fluid (150), such that a transport of condensed working fluid (151) through the capillary structure (200) from the second wall (120) to the first wall (110) is possible.