Method and Apparatus for Controlling a Soldering Process and Method for Automatically Optimizing a Printed Circuit Board

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This invention introduces an advanced method and device for controlling and optimizing soldering processes on printed circuit boards (PCBs). By analyzing the CAD design data of a PCB, the system divides the board into segments, assesses the distribution of electrically conductive material at each soldering point, and uses this information to optimize parameters for the soldering process. Machine learning models are employed to predict and adjust soldering variables, such as temperature and contact time, to ensure optimal solder joints without defects. The method can also automatically suggest design optimizations for PCBs to prevent soldering issues before manufacturing.

Use CasesContent extracted from patent full text and abstract with AI.

• Electronics manufacturing lines for PCBs using wave or selective soldering processes.
• Automated line setup and quality assurance in SMT (surface-mount technology) and THT (through-hole technology) environments.
• Design-for-manufacturing (DFM) analysis and optimization in electronic product development.
• Predictive maintenance and process monitoring for soldering equipment.
• Application in high-density or high-reliability electronic assemblies (e.g., automotive, aerospace, medical devices).

BenefitsContent extracted from patent full text and abstract with AI.

• Significantly reduces defective solder joints by optimizing soldering parameters for each segment of the PCB.
• Minimizes the need for physical prototyping and rework, saving time and production costs.
• Enables rapid adjustment to new board designs via CAD data analysis.
• Supports both local (specific solder joint) and global (entire board) quality assurance.
• Integrates machine learning for faster and more precise process optimization compared to traditional numerical methods.
• Enhances overall reliability and longevity of electronic assemblies by ensuring consistent solder quality.
• Provides actionable feedback for both process parameter tuning and PCB design improvements.
• Facilitates compliance with high-quality standards in critical industries due to improved process control.

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Patent Abstract

The invention provides a method for controlling a soldering process, the method comprising the following steps: f) reading in CAD data regarding a circuit board on which electronic components are to be soldered to through-holes and/or pad fields, and using said CAD data as a circuit board model, the through-holes and/or pad fields each defining a soldering point, g) dividing the circuit board model into a plurality of circuit board segments, each circuit board segment having only a few soldering points, h) determining, for each individual circuit board segment, the distribution of an electrically conductive material contained in the circuit board segment, once in the plan view and once in a side view, so that a horizontal distribution and a vertical distribution are obtained, i) determining a minimum value and/or maximum value of at least one control parameter for a soldering process for soldering the soldering points, such that at least one predefined quality parameter is satisfied for all soldering points, the horizontal distribution and the vertical distribution of each segment being taken into account for this purpose, j) carrying out a soldering process, the at least one control parameter satisfying the determined minimum value and/or maximum value.