Device and Method for Making Contact with an Electronic or Electric System

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention relates to a measurement probe and method for reliably and precisely making electrical contact with electronic systems, such as circuit boards, especially for high-frequency (HF) testing. The probe features a unique contact structure with a coaxial design (having an inner and outer conductor, separated by a dielectric), and a specially formed end region that contacts only a sub-area of the outer conductor, which enhances robustness, ease of automation, and measurement reliability even with production variances. The process includes automated alignment and force-controlled contact, reducing the risk of damage and improving measurement speed and accuracy.

Use CasesContent extracted from patent full text and abstract with AI.

• Automated quality testing of printed circuit boards (PCBs) in manufacturing lines, especially for high-frequency circuits.
• Laboratory measurement and characterization of electronic components and circuit substrates.
• Inline process monitoring and quality assurance in the fabrication of electronic assemblies.
• Functional and quality testing of 3D circuit carriers and other non-planar electronic modules.
• Final inspection of products with integrated antennas or RF circuits (e.g., automotive radar modules).
• Replacement or supplement to traditional manual probing in electronic test procedures.

BenefitsContent extracted from patent full text and abstract with AI.

• Increased robustness and durability of measurement probes, reducing damage and maintenance costs.
• Supports automation of testing processes, saving time and labor costs.
• Reliable measurement results that are less sensitive to misalignment and lateral positioning errors.
• Can accommodate surface unevenness or manufacturing tolerances of test objects, including 3D and non-planar substrates.
• Force-controlled contact minimizes the risk of destroying delicate probe tips or test structures.
• Simplified calibration and setup due to tolerant design.
• Enable fast, precise, and repeatable HF and electrical measurements, even in harsh industrial environments.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a device for making contact with an electronic or electric system, in particular for making contact with a circuit carrier. Said device comprises at least one measurement tip or consists of same, the measurement tip being placeable onto at least one placement structure of the electronic or electric system for measurement purposes and being provided with at least one outer conductor and at least one inner conductor which is surrounded by the outer conductor; at least one dielectric is located between the outer conductor and the inner conductor, and the measurement tip has at least one terminal placement region, by means of which the measurement tip can be placed onto the placement structure of the system, the placement region encompassing only a subarea of the end face of the outer conductor.