Functionalized Redistribution Layer

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes an electronic device that includes a special type of redistribution layer (RDL) placed between a semiconductor chip and its connections. The RDL is 'functionalized' by incorporating adjustment structures which help to fine-tune the radio frequency (RF) performance during signal transitions between the semiconductor chip and surrounding circuitry.

Use CasesContent extracted from patent full text and abstract with AI.

• Advanced radio frequency (RF) chip packaging for wireless communication devices
• High-speed data communication interfaces in smartphones, tablets, and IoT devices
• Improved RF performance in automotive radar sensors
• RF modules in satellite and aerospace electronic equipment
• Optimizing signal integrity in 5G and future communication infrastructure

BenefitsContent extracted from patent full text and abstract with AI.

• Enhanced control of RF properties, leading to improved signal integrity
• Reduced signal loss and reflection at the chip-package interface
• Greater design flexibility for integrating high-frequency chips into electronic systems
• Potential for miniaturization without sacrificing electrical performance
• Supports reliable, high-speed wireless and data communication applications

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

An electronic device which comprises at least one interconnect, a semiconductor chip comprising at least one electric chip pad, an encapsulant structure packaging at least a part of the semiconductor chip, and an electrically conductive redistribution layer arranged between and electrically coupled with the at least one interconnect and the at least one chip pad, wherein the redistribution layer comprises at least one adjustment structure configured for adjusting radio frequency properties of a transition between the semiconductor chip and its periphery.