Method for Manufacturing Ceramic Multilayer Circuit Carriers Based on Slip-Based Additive Manufacturing

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This patent describes an additive manufacturing method for producing multilayer ceramic circuit substrates. The process involves successively creating thin layers of ceramic slurry on a substrate, drying each layer, and directly forming conductive paths within those layers using printing techniques or lasers. Layers are built up in sequence, consolidating the structure, and then the whole assembly undergoes thermal treatment (sintering) to form a dense ceramic component with integrated electronic and structural features. The approach eliminates the need for separate green film fabrication and lamination steps seen in traditional processes, offering more flexibility and efficiency.

Use CasesContent extracted from patent full text and abstract with AI.

• Manufacture of advanced multilayer ceramic circuit boards for electronics (e.g., LTCC, HTCC substrates)
• Rapid prototyping and customization of ceramic electronic components
• Production of microsystem technology (MEMS) components
• Integration of functional structures (conductors, sensors, optical guides) directly into ceramic parts
• Fabrication of high-density electrical interconnects and 3D circuit architectures for miniaturized devices
• Development of sensor and actuator substrates for harsh or high-temperature environments

BenefitsContent extracted from patent full text and abstract with AI.

• Enables complex 3D structures with embedded conductive and functional features in one manufacturing process
• Eliminates labor- and time-intensive steps like green film production and lamination
• Reduces or eliminates the need for organic binders, decreasing costs and environmental impact
• Allows layer thickness and material properties to be finely controlled for high integration density
• Compatible with mass production as well as single-piece and small-batch manufacturing (ideal for prototyping and customization)
• Enables reliable incorporation of fine and precise electrical connections (horizontal and vertical)
• Improves bonding quality between layers, reducing risk of delamination during sintering
• Supports the use of water-based systems, making the process more environmentally friendly

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Patent Abstract

Disclosed is an additive manufacturing process for a ceramic circuit carrier comprising a multilayer structure, said process involving: a) providing a ceramic slip; b) forming a slip layer by blade-coating a support with the ceramic slip; c) drying the slip layer; d) creating at least one horizontal and/or vertical conductor path in at least some areas; e) repeating steps b) to d) using the dried slip layer as a support; f) obtaining a green body comprising a multilayer structure; g) subjecting the green body to a thermal treatment.