Method for analyzing scattering parameter of measurement object e.g. semiconductor component, involves separating and demodulating tapped reference signals of incident wave and tapped returning wave of reflected wave at measuring point

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This invention describes a method and device for analyzing the scattering parameters (S-parameters) of a measurement object, such as a semiconductor component. It works by tapping and demodulating reference signals from both the incident (input) and reflected (output) waves at a measuring point, allowing precise characterization of how the object responds to electrical signals.

Use CasesContent extracted from patent full text and abstract with AI.

• Quality control and testing of semiconductor components in manufacturing
• Performance analysis and validation of electronic components such as integrated circuits, transistors, and RF devices
• Calibration and maintenance of measurement equipment in research and development laboratories
• Non-destructive testing of microwave and high-frequency circuit elements

BenefitsContent extracted from patent full text and abstract with AI.

• Enables accurate and detailed measurement of scattering parameters, which are critical for understanding electronic component behaviors
• Allows for efficient and non-invasive testing of costly or sensitive semiconductor devices
• Improves quality assurance processes by providing precise electrical characterization
• May reduce the need for multiple measurement stations by consolidating the demodulation at a single measuring point, saving time and resources

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Patent Abstract

The method involves transferring generator signal to input switch (2). The generator signal is forwarded as leading wave to coupling unit (3-1,3-2) selected by input switch. The reference signal of the incident wave is tapped in the coupling unit. The reflected wave from object is forwarded towards coupling unit, and returning wave relative to reflected wave is tapped at coupling unit. The tapped signals are sent to single measuring point (5), and are separated and demodulated in point. Th behavior of scattering-parameters of the object is calculated in the point. An independent claim is included for device for analyzing scattering parameter of measurement object.