Component, and Method for the Production Thereof

Simple SummaryContent extracted from patent full text and abstract with AI.

This invention describes a semiconductor component and its manufacturing method, in which an advanced cooling structure is directly integrated onto parts of a semiconductor chip, its electrical connector, or its support substrate. The cooling structure is produced additively (e.g., using laser melting of metal/alloy powder), resulting in efficient thermal management by removing excess heat directly at the source. This approach significantly improves heat dissipation from semiconductor devices, allowing for higher electrical performance and/or increased device reliability.

Use CasesContent extracted from patent full text and abstract with AI.

• High-power electronic modules such as IGBT and MOSFET modules in power electronics
• Microprocessors and logic chips in computing and data centers
• Automotive or industrial motor controllers requiring efficient heat dissipation
• LED modules and high-brightness electronic lighting
• Compact electronic assemblies where space limits traditional heat sinks
• Power supplies and inverters for renewable energy systems

BenefitsContent extracted from patent full text and abstract with AI.

• Significantly improved heat dissipation, resulting in higher power handling and reliability
• Flexible and precise manufacturing of complex, small, or customized cooling structures due to additive manufacturing
• Reduction of thermal resistance by directly bonding cooling structures to the hottest areas (hotspots) of the chip or connector
• Possibility to increase component packaging density as efficient cooling can be provided even in tightly packed assemblies
• Potential for longer device lifespan by maintaining lower operating temperatures
• Enables advanced device miniaturization without compromising on thermal management

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

The invention relates to a component (1) having: at least one support substrate (2) with a first face (21) and an opposite second face (22); at least one first semiconductor chip (3) with a first face (31) and an opposite second face (32), the first face (31) of the semiconductor chip (3) being arranged on the second face (22) of the support substrate (2); and at least one electrical connector (4) which is fastened to a contact of the semiconductor chip (3), wherein at least one cooling structure (5) is situated on at least one portion of the electrical connector (4) and/or on at least one portion of the second face (32) of the semiconductor chip (3) and/or on at least one portion of the support substrate (2), said cooling structure having been produced by melting a powder which contains or consists of a metal or an alloy. The invention also relates to a method for producing such a component.