Heat Sink and Method for Manufacturing a Heat Sink

Simple SummaryContent extracted from patent full text and abstract with AI.

This patent describes a heat sink made from an electrically insulating base material combined with one or more metallic molded components. Each metallic part has a section for mounting and another for transferring heat, which are mechanically attached to the base. The design allows the heat sink to be placed onto a printed circuit board with multiple heat sources at different electrical potentials, where the metallic parts can be soldered directly to or near those heat sources.

Use CasesContent extracted from patent full text and abstract with AI.

• Cooling electronic components on printed circuit boards with multiple, electrically-isolated heat sources.
• Thermal management in complex electronic systems, such as power supplies, automotive electronics, or telecommunications equipment.
• Use in devices that require safe heat dissipation without creating electrical short circuits between components.

BenefitsContent extracted from patent full text and abstract with AI.

• Provides efficient heat dissipation for multiple heat-generating components with different electrical potentials.
• Reduces risk of electrical short circuits due to the electrically insulating base.
• Allows flexible and secure mounting through direct soldering to heat sources.
• Improves reliability and lifespan of electronic devices by maintaining optimal operating temperatures.

Technical Classifications (CPCs)

Inventors & Applicants

Patent Abstract

A heat sink includes a base body of an electrically insulating material and one or several metallic molded parts having a mounting portion and a heat-transfer portion, wherein the heat-transfer portion is mechanically connected to the base body. The heat sink can be inserted on a printed circuit board having several heat sources that can be at different electrical potentials, wherein the mounting portions of the molded parts are soldered to respective heat sources or close to the respective heat sources.