ATLANT 3D Nanosystems ApS
ATLANT 3D Nanosystems ApS is a pioneer in atomic-scale advanced manufacturing, developing multi-material, atomically precise fabrication technologies for micro and nanodevices.
About
ATLANT 3D Nanosystems ApS is a pioneering atomic-scale advanced manufacturing company founded in 2018 in Copenhagen. Its mission is to build the future of atomically precise advanced manufacturing for micro and nanoelectronics, optics, photonics, and more, both on Earth and in space. Its proprietary Direct Atomic Layer Processing (DALP™/DALP®) technology enables rapid, maskless, multi-material deposition and processing—reducing innovation cycles, waste, and costs while achieving atomic-scale precision. ATLANT 3D empowers researchers and industrial R&D with tools such as the Nanofabricator™ series, enabling rapid prototyping, advanced device fabrication, and manufacturing in a broad range of industries, with a strong emphasis on sustainability and innovation. The company operates globally, with research and development hubs, manufacturing labs (A-HUB and A-LAB), and a growing list of strategic industrial and academic partnerships.
Products & Services
- Nanofabricator™ Lite (benchtop atomic-scale fabrication tool for R&D and prototyping)
- Nanofabricator™ Pro (advanced micro/nanofabrication system for industrial R&D, pre-order)
- Nanofabricator™ 0G (advanced, zero-gravity fabrication tool for space and lab use)
- Direct Atomic Layer Processing (DALP®/DALP™) technology license and integration
- Innovation Services (material/process validation, rapid prototyping, custom samples, pilot/joint development, Microfabrication-as-a-Service)
- A-HUB/A-LAB advanced fabrication facilities (contract R&D/production)
Use Cases & Case Studies
- Case Study: Precision Deposition of Advanced Materials for Sensor Fabrication
- Whitepaper: Revolutionizing Prototyping and Design with DALP®
- Whitepaper: Coating Innovations for Micro Devices
- Whitepaper: Optical filters for hyperspectral imaging
- Whitepaper: Electrochemical Glucose Sensor
- Whitepaper: Chip Surgery – Revolutionizing Chip Repair
- User case: Multimaterial device prototypes with DALP®
- Demonstration: Direct-Patterning SnO2/ZnO Deposition by Atomic-Layer Additive Manufacturing
Partnerships & Collaborations
- European Space Agency (ESA) (ESA BIC and ESA Thales projects)
- EU Commission (multiple Horizon Europe projects)
- NASA
- University of Vermont
- Fraunhofer
- Thales Alenia Space
- Technical University of Denmark (DTU)
- Swiss Center for Electronics and Microtechnology (CSEM)
- Aarhus University
- Meyer Burger
- IMEC
- Quantum Italia S.r.l.
- Siemens Cre8Ventures
- Future Dimensions (Saudi Arabia distributor)
- Luxembourg Institute of Science and Technology (LIST)
- Politecnico di Milano
- Prima Additive Srl
- SWEGAN AB
Awards & Recognition
- Forbes Member
- Hello Tomorrow Grand Winner 2021
- EIT Power Up Winner 2019
- Formnext Winner 2021
- Red Herring Winner
- 3D Pioneers Challenge Winner
- Falling Walls Winner 2020
- ITC Gold Winner 2021
- Royal Society of Chemistry Finalist 2020
- GIS in China Winner 2019
- Winner Startup Contest 2021
- Admacom Winner 2019
- Winner XTC 2025 Semiconductors & Ecosystems